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The GL3224 is an USB 3.1 Gen1 Dual/Single LUN card reader controller, it provides 2 LUNs (Logic Unit Number) which can support various types of memory cards, such as Secure DigitalTM(SD), SDHC, miniSD, microSD (T-Flash), MultiMediaCardTM (MMC), RS-MMC, MMCmicro, MMCmobile, Memory StickTM (MS), Memory Stick DuoTM (MS Duo), High Speed Memory StickTM (HS MS), Memory Stick PROTM (MS PRO), Memory Stick PROTM Duo (MS PRO Duo), Memory Stick PRO-HGTM (MS PRO-HG), MS PRO Micro in one chip. It also supports SDXC and Memory Stick XC high density memory cards (capacity up to 2TB) and high speed SD 3.0 UHS-I memory cards.


The GL3224 integrates a high speed 8051 microprocessor and a high efficiency hardware engine for the best data transfer performance between USB and various memory card interfaces. It supports Serial Peripheral Interface (SPI) for firmware upgrade to SPI Flash Memory via USB port. It also integrates 5V to 3.3V and 3.3V to 1.2V regulators and power MOSFETs which can reduce system BOM cost.

  • USB specification compliance
    • Comply with Universal Serial Bus 3.1 Specification rev. 1.0 (USB 3.1 Gen 1)
    • Comply with Universal Serial Bus Specification rev. 2.0 (USB 2.0)
    • Comply with USB Mass Storage Class Specification rev. 1.0
    • Support USB Mass Storage Class Bulk-Only Transport (BOT)
    • Support 1 device address and up to 3 endpoints: Control (0) / Bulk Data Read In (1) / Bulk Data Write Out (2)
    • Support 5 Gbps SuperSpeed, 480 Mbps high-speed, and 12 Mbps full-speed transfer rates
  • Integrated USB building blocks
    • USB2.0 transceiver macrocell (UTM), Serial Interface Engine (SIE), embedded Power-On Reset (POR)
  • Embedded high speed 8051 micro-controller
  • High efficient DMA hardware engine improves transfer rate between USB and flash card interfaces
  • Support Ssecure DigitalTM v1.0/ v1.1/ v2.0/ SDHC/ SDXC (Capacity up to 2TB)
  • Support Secure DigitalTM v3.01 UHS-I (Ultra High Speed): SDR12/ SDR25/ SDR50/ DDR50/ SDR104
  • Support MultiMediaCardTM (MMC)
    • MMC specification v3.x/ v4.0/ v4.1/ v4.2
    • x1/ x4/ x8 bit data bus
  • Support HUAWEI Nano Memory Card
  • Support Memory StickTM/ Memory Stick PROTM/ Memory Stick PRO DuoTM/ Memory Stick PRO Duo Mark2TM/ Memory Stick MicroTM (M2)/ Memory Stick PRO-HGTM/ Memory Stick PRO-HG DuoTM/ Memory Stick PRO-HG Duo HXTM
    • Compliant with Memory Stick Series Specification: MS v1.43, MS PRO v1.05, MS Micro v1.04 (MS HG Micro v1.00), MS PRO-HG Duo 1.03, MS XC Duo v1.00, MS XC-HG Duo v1.00, MS XC Micro v1.00 and MS XC-HG Micro v1.00
    • Support Read/Write quad data access (512Bytex4) for MS PRO-HG to enhance the transmission rate
  • Support Serial Peripheral Interface (SPI) for firmware upgrade to SPI Flash Memory via USB interface
  • On-Chip power MOSFETs for all flash media cards power source
  • On-chip 5V to 3.3V and 3.3V to 1.2V regulator
  • On board 25 MHz Crystal driver circuit
  • Support USB 2.0 LPM (Link Power Management)
  • Support USB 3.1 Gen 1 LTM (Latency Tolerance Messaging)
  • Support USB 3.1 Gen 1 U1/U2/U3 low power link state
  • Pass the USB-IF Test Procedure for SuperSpeed product (TID: 340890039)
  • Pass WHCK (Windows Hardware Certification Kit) test for Windows 8.1 (Submission ID: 1620543)
  • Pass WHCK (Windows Hardware Certification Kit) test for Windows 8 (Submission ID: 1620537)
  • Pass WHQL (Windows Hardware Quality Lab) test for Windows 7 (Submission ID: 1620861)
  • Support two SD3.0 interfaces with UHS-I: SDR12/ SDR25/ SDR50/ DDR50/ SDR104 bus mode
  • Support programmable disable MMC interface
  • Support programmable various LUN (Logic Unit Number): 2 LUNs and 1 LUN
  • Support programmable SSC (Spread Spectrum Clocking), clock rate in SD, MS memory card interface for better EMI test effect.
  • Support programmable LED behavior, Read Only option for specific application
  • Support power-saving mode to disconnect USB bus by card remove for better power management
  • Support selective-suspend for entering suspend mode when data transfer pending after several seconds.
  • Support Over-Current protection mechanism
  • Available in QFN 48 pin package (7x7mm) for 2 LUNs SD 3.0
  • Available in QFN 32 pin package (5x5mm) for 1 LUN SD3.0

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